# RFID Dry Inlay (UHF) — No-Adhesive Lamination Stock

URL: https://proudtek.com/products/rfid-labels/rfid-dry-inlay/
Source URL: https://proudtek.com/products/rfid-labels/rfid-dry-inlay/
Generated: 2026-03-16T01:42:30.697Z
Kind: product
Publisher: Proud Tek Co., Limited
Author: Proud Tek Co., Limited
Credentials: ISO 9001:2015, ISO 14001:2015, RoHS Compliant, CE Marking, REACH Compliant
Image: https://proudtek.com/landing-images/rfid-dry-inlay-hero.jpg
Image Alt: UHF RFID inlay with etched aluminum dipole antenna marked 649_2

## Description
In specification terms, RFID dry inlays are bare chip-on-antenna assemblies on 23-50 µm PET (or 75 µm polyimide / PEN for high-temperature) film with...

## Procurement Snapshot
- Best fit: Best for asset tagging, packaging, authentication, access control, and smart-label projects.
- Customization: Confirm artwork, encoding, material, chip, and finish requirements before quoting.
- Quote checklist: Confirm mounting surface, adhesive or on-metal requirements, and expected reading distance. Share target chip or protocol, quantity, format or size, print or encoding requirements, and the intended application.

## FAQ
- Q: What lamination temperature and pressure do dry inlays withstand?
  A: Standard PET-substrate dry inlays (23-50 µm) are rated for ISO 7810 PVC card lamination at 140-160 °C and 15-20 kg/cm² for 15-20 minutes — the standard process parameters for Mühlbauer CL-series and Melzer CLX presses. PET-G card press runs slightly cooler at 130-150 °C / 12-18 kg/cm² / 12-18 min. Composite (PVC + PET-G) press runs 145-155 °C / 15-20 kg/cm² / 15-20 min. Polycarbonate (PC) card lamination for ICAO 9303 passport / national eID requires polyimide (Kapton) or PEN substrate (75 µm) and wire-bonded / thermocompressed chip-attach (ACP melts at PC press temperature) — rated for 180-200 °C / 25-40 kg/cm² / 20-30 min. Injection over-mold tag production at 200-280 °C / 500-1,000 bar / <10 s residence requires epoxy-encapsulated chip on polyimide substrate. Specify the press temperature target and we match the inlay grade.
- Q: How are dry inlays supplied for automated card production?
  A: Dry inlays ship in four formats: (1) individual die-cut inlays in trays for sheet-fed card presses (Mühlbauer CL, Melzer CLX, Matica MX); (2) on carrier tape for SMT-style automated placement on mid-volume inline lamination lines; (3) continuous rolls on 3″ (76.2 mm) core for roll-fed inline lamination + label converting (Mark Andy P5/P7, Nilpeter FA-17, Atlantic Zeiser DigiLine); (4) pre-positioned on A4 or custom-gang carrier sheets matching customer card collation patterns for sheet-fed press collation systems. We match the supply format to your specific card production equipment (Mühlbauer, HID FARGO, Matica MX, Atlantic Zeiser DigiLine, Bührmann Bobst Visión).
- Q: Can dry inlays be used for dual-interface (contact + contactless) smart cards?
  A: Yes. We supply dry inlay modules with antenna coils that connect to separate contact-chip modules via wire-bonding pads or coupling-frame coupling. This enables dual-interface card production where the same card supports both ISO/IEC 7816 contact-reader and ISO/IEC 14443 contactless-reader communication — the standard architecture for EMVCo banking payment cards (Visa contactless, Mastercard PayPass), government eID, ICAO 9303 passport and corporate access cards. Dual-interface mandates polyimide substrate (PVC press or composite PVC + PET-G works), wire-bonded chip-attach and a coupling-frame antenna structure. NXP JCOP and Infineon SLE78 are the dominant chip choices for dual-interface bank + government cards.
- Q: What's the difference between a PVC card inlay and a polycarbonate card inlay?
  A: The two differ primarily in substrate and chip-attach tolerances required to survive the lamination cycle. PVC card inlays use 23-50 µm PET substrate with ACP-attached chips and are rated for 140-160 °C PVC press cycles (suitable for hotel keys, access cards, transit cards, loyalty cards, retail gift cards). Polycarbonate card inlays use polyimide (Kapton) or PEN substrate (75 µm) with wire-bonded / thermocompressed chips and must survive 180-200 °C PC press cycles (required for ICAO 9303 passports, national eID and machine-readable travel documents under ISO/IEC 7501). Using a PVC-grade inlay in a PC press causes antenna delamination, ACP melt and chip detachment. Using a PC-grade polyimide inlay in a PVC press works but costs 30-60% more per unit than necessary. Specify the press target temperature and intended card body resin (PVC, PET-G, composite, polycarbonate) and we match the inlay grade.
- Q: Can I laminate a UHF dry inlay into an ISO 7810 card?
  A: Yes — UHF RAIN inlays (Impinj M730 / M770 / NXP UCODE 9 / Monza R6-P) can be laminated into ISO 7810 ID-1 cards (85.60 × 53.98 mm), with three caveats. (1) UHF antennas are physically larger than HF/NFC antennas — the card body usually accommodates a slot/loop-tuned antenna rather than a rectangular loop; web 44 mm or square 50 mm is typical. (2) UHF read range on a card held in the hand is reduced by the hand's dielectric loading; expect 1-3 m in practice versus the datasheet 6-8 m for the same chip + antenna. (3) For cards intended for use inside wallets with other metal-backed cards (credit cards), specify a card-body antenna tuned for proximity to metal or accept significant range loss. Card manufacturers typically reserve UHF-inlay cards for IATA Resolution 753 baggage tags, warehouse hardhat tags, yard / depot credentials and long-range inventory rather than general access-control use — for access control HF MIFARE DESFire / NTAG 424 DNA / iCLASS Seos remain the dominant choice.

## Machine Routes
- JSON: https://proudtek.com/machine/products/rfid-labels/rfid-dry-inlay.json
- Text: https://proudtek.com/machine/products/rfid-labels/rfid-dry-inlay.txt